Printed Circuit Board assembly and production process
By Jenny B
@pcbassemblydepot (23)
Morganton, North Carolina
May 14, 2014 2:04am CST
The assembly and fabrication of printed circuit board involves various stages. On the other hand, it is necessary to undergo each stage keeping in mind the associated guidelines to manufacture a product that not only meet client’s requirements but also the industry standards.
One more thing, the output from the previous fabrication stage should be compatible to the input of the next manufacturing stage to ensure that production process in furthering in right direction and highest quality of the product is maintained. This type of production process help to detect errors quickly and PCB fabrication can be attuned accordingly.
When it comes to get the properly functioning printed circuit unit for your electronic project, the involvement of professional PCB assembly services can make a difference. It is because they consist of all equipment that is essential for the production of properly functioning printed circuit board. Moreover, these manufacturing companies are staffed with skilled and experienced professionals that know how to build a product that comply with standards as well as customer specifications.
The assembly of a printed circuit board unit can be carried out through various techniques such as through-hole, surface mount, cable and harness, mechanical, and mixed technology assembly. The selection of the right techniques greatly depends upon clients’ requirements. Most electronics’ hardware these days is fabricated using surface mount technology. The reason is that SMT has various advantages over others in terms of manufacturability and performance.
Let us have a quick look on various stages involved in an assembly process, assuming that surface mount technique is being used here:
Before adding electrical parts on the surface of the PCB board, a special paste, solder paste, is applied on various areas where the electrical components are required to connect. The next step in production process is pick and place in which a machine picks components one by one from the reel of electrical parts and places them onto the right point on the board’s surface.
Once all needed electrical parts are placed on the board, it is passed through joining process in which electrical parts are fixed to the board’s surface using various soldering techniques. If surface mount technique is used, professionals can implement the joining of parts though wave soldering or reflow soldering techniques.
As a final step, inspection is performed on the board to detect poor joints, misplaced electrical parts, and, in some cases, the wrong component. Professionals use special machines to carry out this inspection.
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